Digital Event Horizon
Apple is reportedly collaborating with chip giant Broadcom to develop a custom server processor called "Baltra," which is expected to power Apple's AI services and features built into its operating systems. The project, set to enter production in 2026, represents an exciting development in the company's quest to integrate AI capabilities into its products and services.
Apple is developing a custom server processor called "Balta" in collaboration with Broadcom. The project, expected to debut in 2026, will power Apple's AI services and features. Apple has been working closely with Broadcom to develop the custom server processor. The partnership marks an exciting development in Apple's quest to integrate AI capabilities into its products. Broadcom's XDSiP technology will likely be used to build the multi-die processors for Balta. Apple is using Broadcom's existing technology to minimize costs and accelerate development timeline.
Apple Inc., a tech giant known for its sleek designs and innovative products, has been making waves in the semiconductor industry by reportedly collaborating with chip giant Broadcom to develop a custom server processor. The project, codenamed "Baltra," is expected to make its debut in 2026 and will likely play a significant role in powering Apple's AI services and features built into its operating systems.
According to The Information, which cites three unnamed sources with knowledge of the matter, Apple has been working closely with Broadcom to develop this custom server processor. This partnership marks an exciting development in Apple's quest to further integrate its AI capabilities into its products and services.
The Baltra project is not entirely new; Apple had already hinted at its intentions earlier this year, when Craig Federighi, the company's SVP of software engineering, declared that Apple Intelligence would run both on-device and in a private cloud using servers powered by Apple Silicon. This statement suggests that Apple has been exploring various options for integrating AI into its products, including developing custom server processors.
The involvement of Broadcom, a massive conglomerate with expertise in high-speed networking and semiconductor design, is not surprising. The two companies have already worked together on 5G componentry, which indicates that their partnership will likely extend beyond this project as well.
Broadcom's 3.5D eXtreme Dimension System in Package technology (XDSiP) is a blueprint that customers can use to build multi-die processors of their own. This technology allows for denser electrical interfaces between chiplets, which enables higher die-to-die interconnect speeds and shorter signal routing. The largest designs supported by this technology will accommodate up to 12 HBM3 modules on a single package, totaling more than 6,000 mm² of silicon area.
Coincidentally, the Baltra project is expected to enter production in 2026, which coincides with Broadcom's timeline for its first parts based on these designs. While it is unclear if the two projects are directly related, some Apple chip designs already make use of multi-die architectures, suggesting a possible overlap between the Baltra and other Apple projects.
Apple's approach to developing custom server processors marks an interesting shift in the company's strategy. By leveraging existing technologies and partnering with established companies like Broadcom, Apple can accelerate its development timeline while minimizing costs.
The Register sought comment from both Broadcom and Apple regarding this project; however, neither had responded at the time of publication. As the story unfolds, it will be essential to monitor developments on this front and assess how Baltra and other similar projects might impact the broader tech industry.
Related Information:
https://go.theregister.com/feed/www.theregister.com/2024/12/12/apple_ai_chip_broadcom/
Published: Wed Dec 11 19:57:29 2024 by llama3.2 3B Q4_K_M
